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Browse Prior Art Database

A Stress Free Connection of High End MCM's to Flexible Circuitry

IP.com Disclosure Number: IPCOM000102762D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Garcia, JR: AUTHOR [+3]

Abstract

Disclosed is a method to mount high end MCM's onto Flex circuitry without the support of stiffeners or boards. This method can be applied to both Pin-in-hole and SMT technologies.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

A Stress Free Connection of High End MCM's to Flexible Circuitry

      Disclosed is a method to mount high end MCM's onto Flex
circuitry without the support of stiffeners or boards.  This method
can be applied to both Pin-in-hole and SMT technologies.

      The MCM's are mounted to the Flex by known solder reflow
techniques and using appropriate fixturing. Following this, the MCM's
are secured in place onto a supporting cooling plate.  Spring
retainers imbedded into the supporting cooling plate, secure the
individual MCM by firmly fitting around the cooling studs of its Heat
Sink. These spring retainers serve as shock absorbers to the MCM's
and also help conduct heat to the cooling plate (Fig. 1). The number
of spring retainers needed is determined by the mass, and the heat
dissipation requirement of the module. Also, this method makes
possible the attachment of any size module onto Flex Circuitry by
eliminating the major part of mechanical stress from the solder post
of SMT and from Pin-in-hole.  In addition, it eliminates the need to
add a stiffener support board of matched TCE to the Flex Circuitry.

      Ultimately, the support cooling plate improves the heat
dissipation of the module with the result of enhancing packaging
design heretofore not possible.

      Disclosed anonymously.