Browse Prior Art Database

Solderless Interconnections Method for Molded Circuit Cards

IP.com Disclosure Number: IPCOM000102765D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Aulick, LO: AUTHOR [+3]

Abstract

This disclosure describes a method for the elimination of hand, wave and reflow soldering in the production of Injection Molded Circuit board (IMC) assemblies. Consequently, the subsequent flux cleaning and inspection steps also become unnecessary.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 70% of the total text.

Solderless Interconnections Method for Molded Circuit Cards

      This disclosure describes a method for the elimination of hand,
wave and reflow soldering in the production of Injection Molded
Circuit board (IMC) assemblies. Consequently, the subsequent flux
cleaning and inspection steps also become unnecessary.

      The advent of Injection Molded Circuit boards offers cost
benefits over conventional laminated epoxy FR-4 type substrate
materials in several ways, one being in the form of process step
elimination.

      In addition, injection molding technologies exist that allow
for in-mold circuitization.  However, through holes cannot be done
using this technique.

      Laminated FR-4 circuit boards are typically fabricated by (1)
drilling followed by (2) metallizing to form the desired circuit
pattern.  The bare board is later inspected, populated with devices
and soldered, resulting in the final assembly.

      IMC technology eliminates the need for the drilling step by
injection molding a polymer resin in a mold containing core pins.
The substrate, containing either vias or through holes or both, is
ready for the metallization and soldering steps.

      The placement of eyelets, containing contact tynes, around the
core pins of a mold using an "in-mold" circuitization technique
results in a finished bare board.

      The components can be inserted and, due to the compliant fit of
the leads in the eyelets (with tynes), no further pro...