Browse Prior Art Database

Polyimide Post-Treatment for Layer Hardening

IP.com Disclosure Number: IPCOM000102766D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 58K

Publishing Venue

IBM

Related People

Via, G: AUTHOR

Abstract

The disclosure describes a treatment for Polyimide to enhance the material stability for an insulator matrix for metal wiring planes in VLSI processes.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 63% of the total text.

Polyimide Post-Treatment for Layer Hardening

      The disclosure describes a treatment for Polyimide to enhance
the material stability for an insulator matrix for metal wiring
planes in VLSI processes.

      The polyimide is first spun-applied and partially dried at low
temperature, 250 Centigrades being the final cure. The polyimide is
then patterned using a resist stencil and an 02 etch process.  The
remaining photoresist layer is then removed.

      Next, the polyimide is stabilized to resist abrasion and the
high temperatures in the metal deposition and annealing process.  The
polyimide layer is treated by immersion in a warm 83 centigrade NMP
bath for 4 hours, with no agitation.  This slow heat treatment,
stabilizes the polyimide layer completing the cross linking forming a
strong layer, which cannot be acted upon by 02 plasma. Experiments
followed by SEM analysis have indicated that the layer is impervious
to 800 Centigrade heat treatment, removal by RIE etchers or ashers,
hot (130 Centigrade) NMP and alcohol action.

      Using the polyimide as an insulator matrix, the deposition of
metal, followed by mechanical polishing, will leave a good inlay of
the metal in a very stable matrix, which will not bubble up during
the formation of subsequent metal layers even in a multilayer stack
of 4 to 6 metal layers.

      Experiments, conducted on 20 wafers have allowed formation of
strong and well adhering polyimide layers with the properties
descri...