Browse Prior Art Database

Thermal Control Scheme for Boiling Cooling of Chips With Attached Extended Surfaces

IP.com Disclosure Number: IPCOM000102772D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Edwards, DL: AUTHOR [+3]

Abstract

Disclosed is a method of preventing some chips from being overcooled by boiling in an environment designed to cool higher power chips with extended surfaces.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 98% of the total text.

Thermal Control Scheme for Boiling Cooling of Chips With Attached Extended Surfaces

      Disclosed is a method of preventing some chips from being
overcooled by boiling in an environment designed to cool higher power
chips with extended surfaces.

      This invention uses a common heat sink design for simplicity,
to cool by boiling, chips of differing power requirements.  A heat
sink/adhesive combination is developed that can sufficiently cool the
highest powered chip.  An acceptable set of chip temperatures is
obtained by varying the thickness of adhesive used to attach the heat
sink. This material is applied in minimal and thicker thicknesses.
Thin adhesive layers are used to attach heat sinks to high power
chips, and thicker adhesive layers are used to attach the same heat
sink design to lower power chips.  In this manner, only one heat sink
design is required, high power chips are sufficiently cooled, and low
power chips are not overcooled.

      Many types of adhesives may be used, and their thickness may be
varied in different ways.  For applications where the adhesive is in
the form of a sheet, thicker sheets may be used to increase the
thickness, or additional layers may be applied.  For liquid or paste
adhesive applications, fillers may be added that control the minimum
thickness of the adhesive.

      This invention is applicable to all systems that require heat
sinks on their chips, either for thermal, mechanical or packaging
reasons.

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