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Material And Process for Pin And Line Fabrication for Glass-Ceramic Module

IP.com Disclosure Number: IPCOM000102781D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Brownlow, JM: AUTHOR [+4]

Abstract

A composite conductor material is designed to better match the thermal expansion mismatch between the conductor pins and the insulator material glass ceramic while maintaining the major fraction of the electrical conductivity. Molybdenum or Invar powder is coated with copper by chemical vapor deposition techniques producing a core of material which has a low thermal expansion coefficient and an outer layer of highly electrically conductive material.

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Material And Process for Pin And Line Fabrication for Glass-Ceramic Module

      A composite conductor material is designed to better match the
thermal expansion mismatch between the conductor pins and the
insulator material glass ceramic while maintaining the major fraction
of the electrical conductivity. Molybdenum or Invar powder is coated
with copper by chemical vapor deposition techniques producing a core
of material which has a low thermal expansion coefficient and an
outer layer of highly electrically conductive material.

      The composite structure produced in this way allows the
subsequent sintering processing steps to remain the same so that the
improved material can be readily introduced into the manufacturing
line without change.

      Disclosed anonymously.