Browse Prior Art Database

Disappearing Guard-Bar for Tape Automated Bonding (TAB) Structure

IP.com Disclosure Number: IPCOM000102787D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Horton, RR: AUTHOR [+5]

Abstract

This disclosure describes an idea to hold the outer leads of a TAB package in place until they are soldered to a circuit board. A typical TAB package can have 300 copper leads .001 inch thick by .008 inch wide with an unsupported length of up to .200 inch.

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Disappearing Guard-Bar for Tape Automated Bonding (TAB) Structure

      This disclosure describes an idea to hold the outer leads of a
TAB package in place until they are soldered to a circuit board.  A
typical TAB package can have 300 copper leads .001 inch thick by .008
inch wide with an unsupported length of up to .200 inch.

      A solder preform .004 inch thick by .025 inch wide by the same
length as the TAB package is placed in the lead form and excise tool
for this particular part.  The TAB part is then loaded in the same
cavity and the die is operated. The solder preform is swaged onto
each beam while remaining one continuous piece, and the leads are
excised and formed to the desired shape.

      At this point the package is ready to be soldered in place by a
hot air thermode tool.  The tool picks the lead formed package and
can locate above a circuit board footprint that has no solder on the
termination pads.  The hot gas emanates from the nozzle and the
solder is melted and coalesces in equal amounts on each termination
providing both electrical and mechanical contact.

      Disclosed anonymously.