Browse Prior Art Database

TCM C-Ring Life Enhancement

IP.com Disclosure Number: IPCOM000102823D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 52K

Publishing Venue

IBM

Related People

Bowmaster, T: AUTHOR [+10]

Abstract

This article describes the creation of a composite material which significantly extends the wear life of C-rings employed in Thermal Conduction Module assemblies.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 76% of the total text.

TCM C-Ring Life Enhancement

      This article describes the creation of a composite material
which significantly extends the wear life of C-rings employed in
Thermal Conduction Module assemblies.

      An assembled Thermal Conduction Module (TCM) consists of an
Aluminum (Al) cap, a lead (Pb) plated Inconel C-ring and a ceramic
substrate.  Prior to assembly the C-ring is coated with a wax which
acts as a lubricant during the assembly process.  The wax extrudes
from those portions of the C-ring in contact with the sealing
surfaces during assembly, plastic deformation of the remnant Pb
plating, thereby providing the intimate contact necessary between the
Al cap and the ceramic substrate to form a required hermetic seal.
During temperature cycling, however, movement of the C-ring, cap, and
substrate accelerate the deformation and flow of the Pb from the area
of maximum stress at top and bottom of the C-ring.  In time, the
resultant point contact of the C-ring with both cap and substrate
causes severe wear of the Al and the Inconel by the ceramic substrate
surface.

      Inconel is a hard alloy which resists deformation and which,
due to fabrication-introduced features, easily machines the Al cap as
the assembly elements move due to differences in thermal expansion.
The disclosed solution to this problem involves plating the Inconel
C-ring with a second metal which does not exhibit as severe a plastic
deformation as Pb but is softer than Inconel and will suppor...