Browse Prior Art Database

Pressure Loss Plate for Variable Flow Jet Impingement Cooling of Micro-Electronic Circuits

IP.com Disclosure Number: IPCOM000102834D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 52K

Publishing Venue

IBM

Related People

Carbone, M: AUTHOR

Abstract

Disclosed is a device for varying the flow rate of coolant to different chips on a multi-chip carrier. An array of chips is cooled during test by impinging jets of fluorocarbon liquid (FC). The cooling applied to each chip is a function of the volume flow rate of liquid. A minimum as well as a maximum temperature is of concern, and the volume flow rate of liquid to low powered chips must be reduced to avoid overcooling.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 69% of the total text.

Pressure Loss Plate for Variable Flow Jet Impingement Cooling of Micro-Electronic Circuits

      Disclosed is a device for varying the flow rate of coolant to
different chips on a multi-chip carrier.  An array of chips is cooled
during test by impinging jets of fluorocarbon liquid (FC).  The
cooling applied to each chip is a function of the volume flow rate of
liquid.  A minimum as well as a maximum temperature is of concern,
and the volume flow rate of liquid to low powered chips must be
reduced to avoid overcooling.

      The invention consists of a set of templates and a receptacle
slot on the FC input side of the jet emitter assembly.  Location of
the template slot on the input side of the assembly preserves the
critical flow geometry of the liquid exiting the jet emitters.  The
template corresponding to the unit to be cooled is placed into the
receptacle when the module is loaded into the tester.  The templates
are approximately the same size as the chip carrier, and the central
area of each is divided into cells that correspond to the individual
chip sites.  Holes of various sizes are made in each cell of the
template depending on the flow required for the corresponding chip.
A large hole is used for the sites of high power chips; the flow to
these chips is not restricted by the template.  Flow to medium
powered chips receives moderate restriction.  Low-powered chips,
those coolable by only pool boiling of the FC, receive a reduced but
non-zero flow....