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Hot-Air Nozzle Assembly for Rework of Printed Wiring Boards

IP.com Disclosure Number: IPCOM000102835D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Eddins, JT: AUTHOR [+3]

Abstract

The figure illustrates a hot-air nozzle assembly that removes closely spaced components off from cards for reworking printed wiring boards.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Hot-Air Nozzle Assembly for Rework of Printed Wiring Boards

      The figure illustrates a hot-air nozzle assembly that removes
closely spaced components off from cards for reworking printed wiring
boards.

      A nozzle 1 is placed over a component 4.  Hot air is applied
for loosening solder joints 6 and adhesive 5.  Jaws 3 of nozzle 1
close on component 4 gripping it, and nozzle 1 is then lifted upward,
thereby removing component 4 off card 2 for rework.

      Disclosed anonymously.