Browse Prior Art Database

Wafer Coater Centering Arm Modification

IP.com Disclosure Number: IPCOM000102840D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Related People

Gut, GM: AUTHOR [+2]

Abstract

A modification that inserts two pegs into specific locations in the centering arm of a centering device for semiconductor wafer processing tools is described. This modification permits the processing of varying wafer sizes with very quick and simple modifications to the arm.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Wafer Coater Centering Arm Modification

      A modification that inserts two pegs into specific locations in
the centering arm of a centering device for semiconductor wafer
processing tools is described.  This modification permits the
processing of varying wafer sizes with very quick and simple
modifications to the arm.

      Certain semiconductor wafer processing machines require
centering of the wafers over a spinning chuck in preparation for
coating or developing operations.  These machines employ a centering
arm 1 which is used as a guide against which a wafer 2 is adjusted
to guarantee that it is being centered over the chuck.  A problem
arises when multiple wafer sizes are processed on these machines.
The new technique inserts two pegs 3 into specific locations 4 into
the largest of the centering arms to be employed.  The length of pegs
3 is defined by the difference between the radii between the maximum
wafer diameter 5 and the one currently being processed 6.

      Disclosed anonymously.