Browse Prior Art Database

Heatsink for Tab Device

IP.com Disclosure Number: IPCOM000102852D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Jensen, SM: AUTHOR [+2]

Abstract

Disclosed is a printed circuit board construction which allows a TAB-carried chip to be attached to a thermal path which connects to the PCB ground plane and may extend to a heatsink or the system frame.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Heatsink for Tab Device

      Disclosed is a printed circuit board construction which allows
a TAB-carried chip to be attached to a thermal path which connects to
the PCB ground plane and may extend to a heatsink or the system
frame.

      Common heat dissipation techniques used for TAB-mounted chips
involve the use of heatsinks which are expensive to purchase and to
install or repair.  The proposed construction would provide a direct
copper path from a copper pad (thermal slug) on the exterior of the
board - which is in intimate contact (thermally bonded or soldered)
with the chip device - to the ground plane layer(s) by means of:
      a.   drilled, plated holes (vias): Heat would be absorbed from
the chip by the copper pad and transmitted by the vias to the ground
plane for dissipation over the entire plane area. ;b.   imbedding the
copper pad
           in the board surface so that the copper pad is
           thermally bonded to the ground plane and conducts
           heat directly from the chip device to the ground
           plane.

      If further heat dissipation capacity is required, another
copper pad may be affixed to the backside of the PCB, connected by
vias to the topside copper pad, and a heatsink or the machine frame
placed in intimate contact with the backside pad.

      Disclosed anonymously.