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Resist-Free Ceramic Plating

IP.com Disclosure Number: IPCOM000102880D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Varsik, J: AUTHOR

Abstract

Disclosed is a process for elimination of a photoresist for the additive plating of circuitry on a ceramic substrate. This process also allows double-sided plating as well as the plating of through holes.

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This is the abbreviated version, containing approximately 100% of the total text.

Resist-Free Ceramic Plating

      Disclosed is a process for elimination of a photoresist for the
additive plating of circuitry on a ceramic substrate. This process
also allows double-sided plating as well as the plating of through
holes.

      Ceramic substrates are first blanket sputtered with a thin base
layer of sandwich metallurgy consisting of a very thin chromium
adhesion layer and an overcoat of copper.  The chromium layer can
vary from 50 to several hundred Angstroms in thickness.  The copper
overcoat is of the order of 3000 Angstroms.  The substrate is then
laminated with a dry film photoresist compatible with the alkaline
additive copper plating bath (currently T168), and exposed through a
positive glass master.  The resist is developed allowing for the
tenting of the holes and the circuitry.  The unwanted base layer of
metal is etched away leaving a thin layer of metallurgy under the
photoresist.  The photoresist is then stripped to expose this metal
pattern.  The substrate may then be plated in a conventional
electroless copper plating bath to the desired thickness.

      Disclosed anonymously.