Browse Prior Art Database

Flexy-Pak - Three-Dimensional Memory Package

IP.com Disclosure Number: IPCOM000102885D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Memis, I: AUTHOR [+2]

Abstract

Disclosed is a method of packaging memory chips using high density flexible circuitry with unique assembly and soldering to achieve 20-30 times existing memory densities.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Flexy-Pak - Three-Dimensional Memory Package

      Disclosed is a method of packaging memory chips using high
density flexible circuitry with unique assembly and soldering to
achieve 20-30 times existing memory densities.

      The technology uses conventional chip attachment techniques
(C-4 flip chip or thermal compression bonding) for attaching the
memory device to flexible carrier.  This carrier is then folded such
that the chip can be mounted on edge, perpendicular to a card or
other carrier (see figure).

      The concept can utilize a heat sink for enhanced thermal
dissipation and can accommodate the mounting of discrete components
(capacitors and resistors normally required in memory packages) if
flex with double side metallization and through vias is used.

      Attachment to the card can be accomplished with solder,
conductive epoxies, or conductive elastomers.

      The package density leverage is significant with this concept.
Comparing card real estate usage vs. conventional packaging, this
concept offers a 20-30-fold increase in packaging density.  This
advantage increases when discrete components are considered.

      Disclosed anonymously.