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Browse Prior Art Database

Self Retaining Solder Plug

IP.com Disclosure Number: IPCOM000102888D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Bongiorno, PJ: AUTHOR [+2]

Abstract

The disclosed device is a method to seal printed circuit board openings during wave soldering which cannot be sealed by other methods.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Self Retaining Solder Plug

      The disclosed device is a method to seal printed circuit board
openings during wave soldering which cannot be sealed by other
methods.

      The device consists of a plug (1) and a spring clip (2).  The
plug is low profile so as not to disturb solder flow to adjacent
areas.  Alignment with the opening is achieved by the step in the
body (3).  The plug is held tightly against the circuit board opening
(4) with the clip in order to prevent solder leakage through the
opening.

      The clip allows for variations in the circuit board thickness
and permits the plug to be installed and removed without any tooling.

      Disclosed anonymously.