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Elimination of Residual Methylene Chloride From Photoresist Stripping in Thin Metal/Polymer Circuitry

IP.com Disclosure Number: IPCOM000102889D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Emmi, F: AUTHOR [+4]

Abstract

Disclosed is a process to reduce the level of residual methylene chloride left in Kapton* during the fabrication of TAB circuits.

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This is the abbreviated version, containing approximately 95% of the total text.

Elimination of Residual Methylene Chloride From Photoresist Stripping in Thin Metal/Polymer Circuitry

      Disclosed is a process to reduce the level of residual
methylene chloride left in Kapton* during the fabrication of TAB
circuits.

      Metallization processes for the fabrication of TAB lines
include sequential deposition of chromium and copper layers.
Photoimaging is normally accomplished by the use of a photoresist
film, which can be removed by a chlorinated solvent, such as
methylene chloride.  Since absorption of the solvent into Kapton is
possible, the potential for solvent decomposition during additional
thermal processes is enhanced.  In addition, metal surfaces, such as
copper, will catalyze the formation of chloride ions.  These ions are
notoriously active on copper/chromium interfaces upon exposure to
moisture and/or thermal environments.

      The disclosed process consists of a sequential extraction of
the residual methylene chloride from the polymer film by treatment
with methanol at 50oC for 3 hours and warm DI water (80oC for 1
hour).  Methanol is chosen because it can easily exchange with
methylene chloride in a polyimide matrix.  The water treatment
maximizes the removal of some already formed ionic chlorides either
by the thermal process or tape processing.

      This approach can be extended to other polymer systems for
similar application in which methylene chloride is used for
photoresist stripping.
*  Trademark of E.I. d...