Browse Prior Art Database

Pin Attach Tool

IP.com Disclosure Number: IPCOM000102920D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Hernandez, BL: AUTHOR [+6]

Abstract

The I/O connection for multi-layer ceramic substrates takes the form of a closely spaced array of pins soldered to the substrate. Pin removal and re-attachment requires that adjacent pins not be reflowed during rework.

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Pin Attach Tool

      The I/O connection for multi-layer ceramic substrates takes the
form of a closely spaced array of pins soldered to the substrate.
Pin removal and re-attachment requires that adjacent pins not be
reflowed during rework.

      The solution to the problem of localizing the heat needed to
reflow the solder which holds the pin to the substrate is the
construction of an electrically heated pin attach tool shown in
Figure 1.  The tool is an electrically heated metal thermode whose
tip fits closely around the pin to be reworked.  The thermode may be
mounted on any electrically controlled heating stage.  The pin attach
tool may be used either for removal or attachment of pins.

      Disclosed anonymously.