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Laser Preparation of Epoxy Glass Composites for Electrolytic Metal Deposition

IP.com Disclosure Number: IPCOM000102964D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Burns, FC: AUTHOR [+2]

Abstract

Disclosed is a method for preparing selected areas of epoxy glass composites for electrolytic metal deposition. An excimer laser is used to ablate the epoxy and to create a conductive layer on exposed glass cloth.

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Laser Preparation of Epoxy Glass Composites for Electrolytic Metal Deposition

      Disclosed is a method for preparing selected areas of epoxy
glass composites for electrolytic metal deposition.  An excimer laser
is used to ablate the epoxy and to create a conductive layer on
exposed glass cloth.

      Typical printed circuit boards consist of layers of glass cloth
bonded together by an epoxy.  Circuit lines on the surface of the
printed circuit boards are created by standard photolithographic
techniques.  Described below is an alternative method for creating
lines on epoxy glass composites in general and printed circuit boards
in particular.  The method of this disclosure does not require the
use of photoresists nor the subtractive etching of metals.

      The epoxy glass composite is placed in an appropriate fixture
and is exposed to an excimer laser beam of sufficient fluence
(energy/cm2) to ablate the epoxy. Complete ablation of the epoxy
exposes the glass cloth to the excimer laser beam.  A conductive film
is produced on the glass cloth by the action of the excimer laser on
the epoxy-glass composite.  Circuit patterns of conductive film are
defined by turning the excimer laser beam on and off while the epoxy
glass composite is scanned underneath the beam.  An alternative
method for defining the circuit patterns is to scan the excimer laser
beam across the epoxy glass composite.

      Electrical contract is made with the conductive film, and t...