Browse Prior Art Database

Filling Air Gap Under Components

IP.com Disclosure Number: IPCOM000102969D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 38K

Publishing Venue

IBM

Related People

Lei, CC: AUTHOR [+2]

Abstract

The air gap between a component body and printed circuit board surface is filled with a polymeric material for thermal enhancement of the hardware. Disclosed is a method for filling this air gap.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Filling Air Gap Under Components

      The air gap between a component body and printed circuit board
surface is filled with a polymeric material for thermal enhancement
of the hardware.  Disclosed is a method for filling this air gap.

      Polymeric material is mixed with solvent to reduce its
viscosity so that the polymer can be used to fill the gap between the
component body and printed circuit board surface by dispensing a
continuous bead on one, two, or three sides of the component edge.
However, dispensing polymeric material on all four sides of the
component will not achieve a good fill factor because there is no
space for the entrapped air to escape.  Capillary action is the
driving force for the polymeric material to flow underneath the
component.

      Referring to the figures, a bead of polymeric material 1 is
dispensed on the leads 2 of gull wing component 3.  Due to capillary
action, the polymeric material will flow under the component body and
the printed circuit board surface 4.

      Disclosed anonymously.