Browse Prior Art Database

Mechanically Self-Locking Low Temperature Solder Joint

IP.com Disclosure Number: IPCOM000102973D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

DeBoskey, WR: AUTHOR [+2]

Abstract

Solders containing more than 50% bismuth by volume exhibit a unique property which can be used to provide mechanical support as well as electrical connection. These solders expand rather than contract upon solidification. In certain applications, such as when utilizing 3-dimensional molded circuit cards, conventional components are required, but plating through holes is not desirable because of appearance or functional requirements. Surface mount appearance can be achieved using these conventional components and blind holes filled with the bismuth-containing solders.

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Mechanically Self-Locking Low Temperature Solder Joint

      Solders containing more than 50% bismuth by volume exhibit a
unique property which can be used to provide mechanical support as
well as electrical connection.  These solders expand rather than
contract upon solidification.  In certain applications, such as when
utilizing 3-dimensional molded circuit cards, conventional components
are required, but plating through holes is not desirable because of
appearance or functional requirements.  Surface mount appearance can
be achieved using these conventional components and blind holes
filled with the bismuth-containing solders.

      Fig. 1 shows a conventional, axial leaded component mounted in
this fashion.  Upon solidification, the solder expands, forming a
mechanical bond as well as an electrical bond between the component
lead and the metallized component socket.

      Fig. 2 shows a dip package mounted in a similar fashion.

      Disclosed anonymously.