Browse Prior Art Database

Wafer Lift

IP.com Disclosure Number: IPCOM000102990D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Related People

Gangl, DV: AUTHOR [+3]

Abstract

The figure illustrates tooling which provides a lift to aid in removal of silicon wafers from manufacturing cassettes by staggering and spacing the wafers such that there is a gap on their top side. This gap allows room for handling equipment.

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This is the abbreviated version, containing approximately 100% of the total text.

Wafer Lift

      The figure illustrates tooling which provides a lift to aid in
removal of silicon wafers from manufacturing cassettes by staggering
and spacing the wafers such that there is a gap on their top side.
This gap allows room for handling equipment.

      The tooling comprises a "U" shaped piece 3 of Delrin* material
that is cut as a tapered lift 1.  Lift 1 allows for a front wafer
2 to be lifted to an exact height and the ones after it to be
staggered down approximately 3/16 inch.

      The tooling is mounted on a work surface, and then a cassette
is lowered over it.  The first wafer is visually aligned to the first
slot.  As the cassette is lowered, it automatically aligns itself
inside the cassette due to its width dimension matching that of the
inside opening in the cassette.
* Delrin is a trademark of DuPont.

      Disclosed anonymously.