Browse Prior Art Database

Thermal Alignment Process

IP.com Disclosure Number: IPCOM000102993D
Original Publication Date: 1990-Apr-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Related People

Parente, M: AUTHOR [+2]

Abstract

Disclosed is a thermomechanical process for straightening a pin grid array in a fire resistant spray glass (FR4) planar socket carrier resulting in required pin-to-pin location tolerance and carrier flatness. 1. The socket pin array and carrier assembly are constrained in a hole grid restraining device held to a location tolerance ten times greater than is required for the socket/carrier assembly. 2. The assembly is ramped up to a temperature greater than Tg (Glass Transition Temperature) of the carrier material being used. 3. The constrained assembly is then removed from the heat source and slowly cooled to room temperature. 4. The socket pin carrier is removed from the restraining device with the pin grid array permanently aligned as required.

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Thermal Alignment Process

      Disclosed is a thermomechanical process for straightening a pin
grid array in a fire resistant spray glass (FR4) planar socket
carrier resulting in required pin-to-pin location tolerance and
carrier flatness.
1.   The socket pin array and carrier assembly are constrained in a
hole grid restraining device held to a location tolerance ten times
greater than is required for the socket/carrier assembly.
2.   The assembly is ramped up to a temperature greater than Tg
(Glass Transition Temperature) of the carrier material being used.
3.   The constrained assembly is then removed from the heat source
and slowly cooled to room temperature.
4.   The socket pin carrier is removed from the restraining device
with the pin grid array permanently aligned as required.

      Anonymous.