Browse Prior Art Database

Electronic Assembly Cover Method

IP.com Disclosure Number: IPCOM000103041D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 40K

Publishing Venue

IBM

Related People

Verne, RD: AUTHOR

Abstract

Disclosed is a method for enclosing electronic circuits mounted on printed circuit cards. This cover method provides integral mechanical support to the card and enhanced electromagnetic shielding to the circuitry.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Electronic Assembly Cover Method

      Disclosed is a method for enclosing electronic circuits mounted
on printed circuit cards.  This cover method provides integral
mechanical support to the card and enhanced electromagnetic shielding
to the circuitry.

      In the figure, the formed surfaces 7 of the top cover 1 and
bottom cover 2 contact the top and bottom surfaces near the edges of
the circuit card 3, holding the card securely in place.  The tinned
regions 4 along the edges of the circuit card make continual contact
with the covers, increasing the conductivity between the card and the
covers, thus improving the effectiveness of the electromagnetic
shielding.  The tinning process for these edge areas is performed by
the same process that produces the printed circuits on the circuit
card, thus requiring no additional processing.

      The top cover 1 and bottom cover 2 are fastened together with
machine screws 5 through overlapping sections.

      The shield system disclosed performs several functions in two
pieces of formed sheet metal:
           provide electromagnetic shielding
           provide mechanical support and protection for the
           circuit card assembly
           provide a mounting structure 6 for control switches,
indicators and the like.

      Disclosed anonymously.