Browse Prior Art Database

Individualized Wafer Lifting Apparatus

IP.com Disclosure Number: IPCOM000103048D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Gangl, DV: AUTHOR [+3]

Abstract

Illustrated in the figures is a tooling which partially lifts silicon wafers out of manufacturing cassettes. This method provides an improved means of retrieving a single silicon wafer from a wafer cassette without contacting and possibly damaging adjacent wafers stored in the cassette.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Individualized Wafer Lifting Apparatus

      Illustrated in the figures is a tooling which partially lifts
silicon wafers out of manufacturing cassettes.  This method provides
an improved means of retrieving a single silicon wafer from a wafer
cassette without contacting and possibly damaging adjacent wafers
stored in the cassette.

      The tooling 1 is manufactured out of a clean room-approved
plastic in the shape shown in Fig. 1.  A top angled portion 2 is cut
with a "V" groove to allow centering characteristics when inserted
into the cassette.  The insert removed 3 allows the tooling 1 to hold
itself in position on the cassette walls.

      The tooling 1 is inserted as shown in Fig. 2 into the
manufacturing cassette 4.  This in turn lifts the wafer up and keeps
it there so the wafer can be handled.  Once the wafer is returned
back to the slot, the tooling 1 is then removed.

      Disclosed anonymously.