Browse Prior Art Database

Laser Diode to Heatsink Attachment Method

IP.com Disclosure Number: IPCOM000103057D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Luecke, F: AUTHOR

Abstract

Disclosed is a design which facilitates the mounting of a diode laser to a heatsink in such a way that the output beam direction of the laser may be accurately aligned to the higher level assembly mounting datum of the heatsink in the presence of misalignment of the laser chip within its case.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Laser Diode to Heatsink Attachment Method

      Disclosed is a design which facilitates the mounting of a diode
laser to a heatsink in such a way that the output beam direction of
the laser may be accurately aligned to the higher level assembly
mounting datum of the heatsink in the presence of misalignment of the
laser chip within its case.

      As shown in the figure, an adaptor ring is inserted between the
laser package and the heatsink. The ring is formed with an
approximately spherical radius on its periphery and is made of a
malleable metal such as copper. This combination permits the laser to
be pressed and held securely in position and also permits flow of
heat from the laser, regardless of the laser mounting angle required
for beam alignment.

      Further improvement in both heat flow and mounting security may
be obtained by the addition of solder to the joint.

      Disclosed anonymously.