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Method to Improve the Bondability of Perfluoroalkylpolyether Lubricant on Thin Film Magnetic Storage Disk

IP.com Disclosure Number: IPCOM000103059D
Original Publication Date: 1990-May-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Related People

Kasai, P: AUTHOR [+3]

Abstract

Perfluoropolyether (PFPE) is the most widely used thin film disk lubricant. It significantly lowers the head/disk sliding friction and enhances the wear resistance of the disk coating. However, the topically applied lubricant suffers loss from air shear and centrifugal forces due to the high spinning speed of the disk, and from thermal evaporation. To enhance retention it is therefore desirable to bond the lubricant onto the disk surface.

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Method to Improve the Bondability of Perfluoroalkylpolyether Lubricant on Thin Film Magnetic Storage Disk

      Perfluoropolyether (PFPE) is the most widely used thin film
disk lubricant. It significantly lowers the head/disk sliding
friction and enhances the wear resistance of the disk coating.
However, the topically applied lubricant suffers loss from air shear
and centrifugal forces due to the high spinning speed of the disk,
and from thermal evaporation.  To enhance retention it is therefore
desirable to bond the lubricant onto the disk surface.

      The present invention describes a method to insert peroxy-
linkages to PFPE to improve its bondability by ultraviolet (uv) light
and by heat.  Peroxy-linkages could be inserted into the lubricant
molecule by bubbling the pure lubricant with oxygen gas under far uv
light irradiation at room temperature.  The presence of the
peroxy-linkage in the product is confirmed by various analytical
techniques including Fluorine-19 Nuclear Magnetic Resonance, Thermal
Gravimetric Analysis and Electron Spin Resonance.   The resulting
product could be bonded to the thin film disk surface by uv light
irradiation and by heating at 150o C. The untreated material, in
comparison, could be bonded only by far uv irradiation but not by
thermal means.  The peroxy containing product also shows a 50 to 80%
improvement in efficiency over the untreated material when bonded by
uv light irradiation.

      Disclosed anonymously.