Browse Prior Art Database

Tab Heat Sink Rework Method

IP.com Disclosure Number: IPCOM000103069D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR

Abstract

A method is described to effectively break the adhesive bond between a silicon chip component and a sheet metal heat sink during a rework process. (Image Omitted)

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Tab Heat Sink Rework Method

      A method is described to effectively break the adhesive bond
between a silicon chip component and a sheet metal heat sink during a
rework process.

                            (Image Omitted)

      A thermal adhesive is used to bond the chip to the heat sink to
assure thermal conductivity.  This bond is broken in order to remove
the heat sink and provide access to the silicon chip carrier device
for rework.

      The prior art uses a tool that dimples and deforms the sheet
metal on the side opposite that of the chip.  The deformation breaks
the interface between the silicon chip and chip metal heat sink.  The
problem with the prior art is that at times the silicon chip is
fractured and loose silicon particles are scattered around the
surface of the circuit card.

      The improved method deforms the sheet metal heat sink at the
interface of the chip and heat sink by folding the sheet metal.
Folding of the sheet metal heat sink can be accomplished with a
simple hand tool or automated tooling. This improved method reduces
chances of damage to the chip and circuit card.

      Disclosed anonymously.