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Additive Plating for Thermoplastic Carriers

IP.com Disclosure Number: IPCOM000103070D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Frankeny, RF: AUTHOR [+2]

Abstract

The present plating process provides a novel approach for fabrication of electrical circuitry on thermoplastic carriers. Metallization of the plastic carriers is carried out as follows: 1. Apply a photoresist to the thermoplastic carrier - a semi-aqueous resist is preferred. 2. Develop, expose and etch the photoresist. 3. Brush or spray an organic solvent at the exposed thermoplastic carrier surface (the choice of solvent depends on the thermoplastic carrier). Wait for 10 to 15 seconds or until the surface becomes tacky. While the surface is still tacky, apply a fine powder of a catalyst such as nickel or palladium. 4. Plate in an electroless plating bath followed by electrolytic plating. 5. Strip the photoresist and dry.

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Additive Plating for Thermoplastic Carriers

      The present plating process provides a novel approach for
fabrication of electrical circuitry on thermoplastic carriers.
Metallization of the plastic carriers is carried out as follows:
   1.  Apply a photoresist to the thermoplastic carrier - a
semi-aqueous resist is preferred.
      2.  Develop, expose and etch the photoresist.
      3.  Brush or spray an organic solvent at the exposed
thermoplastic carrier surface (the choice of solvent depends on the
thermoplastic carrier).  Wait for 10 to 15 seconds or until the
surface becomes tacky. While the surface is still tacky, apply a fine
powder of a catalyst such as nickel or palladium.
      4.  Plate in an electroless plating bath followed by
electrolytic plating.
      5.  Strip the photoresist and dry.

      This approach eliminates sensitization activation and
subtractive etching carriers commonly used in circuit board
manufacturing.

      Disclosed anonymously.