Browse Prior Art Database

Retention for Memory Connectors

IP.com Disclosure Number: IPCOM000103071D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Related People

Davis, TL: AUTHOR

Abstract

This disclosure documents a technique for using the high temperature plastics while ensuring adequate retention features. Figure 1 illustrates the disclosed concept for the connector. The plastic features that are molded into the connector may be stamped out of a spring type metal. Eliminating the molded retention features simplifies the connector's mold and may increase throughput by using lower molding pressures to fill the cavities. Even though an additional part is introduced into the assembly, the advantages of using a high temperature plastic offset manufacturing induced problems and eliminate the yield problems with broken retention features.

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Retention for Memory Connectors

      This disclosure documents a technique for using the high
temperature plastics while ensuring adequate retention features.
Figure 1 illustrates the disclosed concept for the connector.  The
plastic features that are molded into the connector may be stamped
out of a spring type metal. Eliminating the molded retention features
simplifies the connector's mold and may increase throughput by using
lower molding pressures to fill the cavities.  Even though an
additional part is introduced into the assembly, the advantages of
using a high temperature plastic offset manufacturing induced
problems and eliminate the yield problems with broken retention
features.

      Disclosed anonymously.