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Component Removal Technique for Fine Pitch Devices

IP.com Disclosure Number: IPCOM000103074D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Nguyen, DQ: AUTHOR [+3]

Abstract

In applications involving low solder volumes (example: solder application to 0.006" on 0.0125" or 0.004" on 0.008" sites) or solderless attachment schemes (ultrasonic bonding or thermocompression bonding), the removal of the defective component can be accomplished using compressed air at 100 psig issuing out of a 0.125" diameter nozzle. The center line of the jet is directed at the area of the joints.

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Component Removal Technique for Fine Pitch Devices

      In applications involving low solder volumes (example: solder
application to 0.006" on 0.0125" or 0.004" on 0.008" sites) or
solderless attachment schemes (ultrasonic bonding or
thermocompression bonding), the removal of the defective component
can be accomplished using compressed air at 100 psig issuing out of a
0.125" diameter nozzle.  The center line of the jet is directed at
the area of the joints.

      This pneumatic removal technique yields the following
advantages:
      (1)  Noncontact method of removal.
      (2)  No high temperatures treatment of substrate, which results
in less substrate warpage and higher reattachment yield.  Further,
the device itself is not subjected to a high temperature removal
operation.
      (3)  Less removal time.
      (4)  Low capital cost, less equipment space requirements, low
maintenance cost and amenable to automation.

      Disclosed anonymously.