Browse Prior Art Database

Helium Ambient Hermetic Module Sealing

IP.com Disclosure Number: IPCOM000103080D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 60K

Publishing Venue

IBM

Related People

Leas, J: AUTHOR

Abstract

Disclosed is a process which allows elimination of the high pressure bomb step now required as part of the test of the hermetic seal of semiconductor modules. Instead, helium is introduced into all modules during the hermetic sealing process itself.

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This is the abbreviated version, containing approximately 60% of the total text.

Helium Ambient Hermetic Module Sealing

      Disclosed is a process which allows elimination of the high
pressure bomb step now required as part of the test of the hermetic
seal of semiconductor modules.  Instead, helium is introduced into
all modules during the hermetic sealing process itself.

      Semiconductor modules are hermetically sealed to prevent
moisture from entering and corroding metal contacts. Each module must
be individually tested to assure that there are no fine leaks.  The
test is done by forcing helium into the modules in a high pressure
chamber for several hours and then detecting escaping helium in a low
pressure chamber. Helium will only be forced into and then emitted
from those modules that have leaks.  In the absence of leaks, helium
will not get into the module and will not be detected.

      The process eliminates the high pressure step, allowing a
significant reduction in time needed to produce the finished product.
A small fraction of helium is mixed with the dry nitrogen gas
typically used to fill semiconductor modules.  Thus, a small amount
of helium would be introduced into all modules.  Immediately after
sealing, the modules would be put into the helium leak detection
chamber and tested for the emission of helium.  Only those modules
with leaks would emit the helium.

      Since only a few percent helium in the module is needed to
conduct a successful leak test after sealing, the above procedure
would be sufficient...