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Electrical Connection by Displacement of Internal Plates

IP.com Disclosure Number: IPCOM000103097D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Carey, G: AUTHOR [+4]

Abstract

This technique provides electrical connection by displacing internal plates resulting in the elimination of predrilling and copper plating plated thru holes (PTHs). (Image Omitted)

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Electrical Connection by Displacement of Internal Plates

      This technique provides electrical connection by displacing
internal plates resulting in the elimination of predrilling and
copper plating plated thru holes (PTHs).

                            (Image Omitted)

      Power circuit card or panel 1 has a laminated top copper layer
51, a dielectric prepreg layer P and a thick copper base plate 52.

      The circuit card or panel 1 is positioned on the punch guide
plate 2 between plate 2 and die d.  The controlled cycle punch 3 is
pressed into the copper base plate S2 forcing some copper material,
slug 4, up and into the top copper layer S1.   The distance the slug
4 is moved is controlled by the stroke of the punch press and is
judiciously selected to remove the cap 5.

      This technique has the following advantages:  All required
connections can be made on each circuit card or panel.  Multiple
punch and die sets can be made to punch the whole set of holes in
one stroke of the punch press.

      The protruded cap 5, which is a piece of the circuit card,
i.e., copper S1 and prepreg P, is removed by a brushing operation.

      During the assembly process the copper connection pad will be
soldered for both a good electrical and thermal connection.  This
technique can be used for multilayer printed circuit cards or boards.

      Disclosed anonymously.