Browse Prior Art Database

Resin Soaking

IP.com Disclosure Number: IPCOM000103099D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Related People

Hayden, TH: AUTHOR [+2]

Abstract

The resin pretreatment described in this article reduces the number of pin holes occurring when photoresist formulations are force-developed to increase sensitivity levels.

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This is the abbreviated version, containing approximately 100% of the total text.

Resin Soaking

      The resin pretreatment described in this article reduces the
number of pin holes occurring when photoresist formulations are
force-developed to increase sensitivity levels.

      When a resist formulation comprising a polysulfone and a Varcum
novolak resin is force-developed to raise its sensitivity, a thinning
occurs in the unexposed film, resulting in an unacceptable level of
pin holes.  This is believed due to the presence of foreign ionic
contaminants in the bulk resin.  Pretreatment of the novolak resin by
soaking in an extraction solvent, e.g., water or methylcyclohexane,
prior to resist formulation, reduces the thinning and eliminates the
pin hole problem while allowing for improvements of 20% in resist
sensitivity.  This is important in applications where E-beam
sensitivity is a tool throughput factor.

      Disclosed anonymously.