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Subcooler for Liquid Nitrogen Cooling of Electronic Circuits with Indirect Refrigeration

IP.com Disclosure Number: IPCOM000103110D
Original Publication Date: 1990-Jun-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 51K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+2]

Abstract

Semiconductor chips are attached to a substrate in a row and column array, as is conventional. The chips are cooled by immersion in liquid nitrogen. Cooling may be augmented by known methods, such as attachment of extended surfaces or jet impingement. One or more substrates, the liquid nitrogen, and any additional chip cooling apparatus are packaged in a sealed enclosure. Heat is removed from the enclosure by a heat exchanger immersed in the liquid or by condensing the vapor in a gas volume above the liquid. Conventional refrigeration technology may be used. A blower that circulates gas and vapor in the enclosure will increase the rate of condensation by decreasing the concentration of non-condensibles adjacent to the condenser. The liquid is subcooled (e.g.

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Subcooler for Liquid Nitrogen Cooling of Electronic Circuits with Indirect Refrigeration

      Semiconductor chips are attached to a substrate in a row and
column array, as is conventional.  The chips are cooled by immersion
in liquid nitrogen.  Cooling may be augmented by known methods, such
as attachment of extended surfaces or jet impingement.  One or more
substrates, the liquid nitrogen, and any additional chip cooling
apparatus are packaged in a sealed enclosure.  Heat is removed from
the enclosure by a heat exchanger immersed in the liquid or by
condensing the vapor in a gas volume above the liquid. Conventional
refrigeration technology may be used.  A blower that circulates gas
and vapor in the enclosure will increase the rate of condensation by
decreasing the concentration of non-condensibles adjacent to the
condenser.  The liquid is subcooled (e.g., the saturation temperature
is raised above the liquid temperature) by charging the enclosure
with a small volume of non-condensible gas, such as helium, so that
the total pressure is the sum of the liquid's vapor pressure and the
pressure of the non-condensible gas.  The effect of subcooling is to
increase the minimum heat flux for film boiling (CHF), thereby
increasing the maximum heat flux that can be dissipated by a chip and
to decrease the void fraction in flow boiling cooling schemes.

      The drawing shows the electronics (1) which are cooled in an
enclosure (2) by direct immersion in liquid nitro...