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Liquid Layup of Printed Circuit Boards

IP.com Disclosure Number: IPCOM000103133D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Pscheidt, E: AUTHOR [+3]

Abstract

Disclosed is a new method of creating the insulating layers in a circuit board by wet coating the non-conductive material directly onto copper foil and internal planes, and then laminating the parts together. See the Figure.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Liquid Layup of Printed Circuit Boards

      Disclosed is a new method of creating the insulating layers in
a circuit board by wet coating the non-conductive material directly
onto copper foil and internal planes, and then laminating the parts
together.  See the Figure.

      This mixture could be applied by curtain coating.  This
involves pumping a liquid or suspension through a slit and passing
the core or copper through the resultant curtain. The thickness is
controlled by slit width, head pressure, and conveyor speed.  After
coating, the applied insulating layer needs to set up.  This is done
by evaporation of a carrier liquid.  The coated foil and cores can
now be assembled and laminated.

      Alternatively, the liquid may be applied with extrusion
coating, roller coating, spraying, or electrostatic coating. The
substrate may be various metal foils, a conductor, a semiconductor, a
previously manufactured inner layer, or a previously manufactured
multilayer.

      The first described method may include an additional step of
isolating the inner layers by wet coating the internal planes with a
polymer to fill in between the circuitry or clearance holes and then
laminating the parts together using prepreg.

      Disclosed anonymously.