Browse Prior Art Database

Low Profile Cooling Device for Semiconductor Circuit Chips

IP.com Disclosure Number: IPCOM000103165D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Kan, JC: AUTHOR [+2]

Abstract

Disclosed is a heat sink that, when attached to an electrical chip, enhances the heat dissipation capability of the chip by a significant factor. It is designed for use during immersion in a liquid coolant.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Low Profile Cooling Device for Semiconductor Circuit Chips

      Disclosed is a heat sink that, when attached to an electrical
chip, enhances the heat dissipation capability of the chip by a
significant factor.  It is designed for use during immersion in a
liquid coolant.

      The heat sink depicted here is used to increase the rate of
heat flow from a variety size class of chips.  Due to its
configuration, its attachment to the chip increases the effective
area by a factor of "pi" (3.1416) while the overall height is
increased only modestly over the height of the chip.

      This heat sink is constructed by metallurgically joining small
copper balls 10 to a piece of copper foil 11. The balls are arranged
in an array with each sphere contacting those next to it, effectively
covering the top surface of the foil.  The heat sink is then attached
to the chip 1 surface.  During immersion in the liquid coolant, the
increased area offered by the ball array serves as radiating surfaces
and nucleation points for bubble generation.

      Disclosed anonymously.