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Browse Prior Art Database

Improvement of Polyimide Adhesion by Wet Process

IP.com Disclosure Number: IPCOM000103177D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 66K

Publishing Venue

IBM

Related People

Feger, C: AUTHOR [+5]

Abstract

Disclosed is a process describing a method to create improved adhesion of polyimide to polyimide and metal to polyimide. The polyimide surface is modified by a wet process which consists of treating the fully cured polyimide with dilute base solution (KOH, NaOH, etc.), rinsing with water, neutralizing with acid, rinsing with water, and rinsing with isopropanol.

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Improvement of Polyimide Adhesion by Wet Process

      Disclosed is a process describing a method to create improved
adhesion of polyimide to polyimide and metal to polyimide.  The
polyimide surface is modified by a wet process which consists of
treating the fully cured polyimide with dilute base solution (KOH,
NaOH, etc.), rinsing with water, neutralizing with acid, rinsing with
water, and rinsing with isopropanol.

      Polyamic acid, polyamic ester and polyisoimide are uncured
polyimides.  Polyimide-polyimide adhesion by coating uncured
polyimide to fully cured polyimide is usually low. On the other hand,
when uncured polyimide is cast onto uncured polyimide, the films are
inseparable.  This disclosed process mimics this by converting the
polyimide surface to polyamic acid.  The chemical reaction is limited
to the surface (200-250 Ao), so the bulk properties of polyimide
remain unchanged.

      Polyimides are treated with dilute KOH (or NaOH) aqueous
solution to give the corresponding potassium polyamate (potassium
salt of the polyamic acid).  Upon treatment with dilute acetic acid,
trifluoroacetic acid, or hydrochloric acid, the potassium polyamate
is transformed to polyamic acid which upon curing regenerates the
original polyimide.  The results of X-ray photoelectron spectroscopy
(XPS) and external reflectance infrared (ER IR) spectra are
consistent with this chemistry.  Elements (potassium and flourine) of
the salts and acid are not detected in th...