Browse Prior Art Database

Metallization of Hydrolyzed Polyimide Surfaces Catalyzed by Ion Exhanged Pd

IP.com Disclosure Number: IPCOM000103181D
Original Publication Date: 1990-Jul-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

O'Sullivan, E: AUTHOR [+2]

Abstract

Disclosed is a method for the catalysis and electroless deposition of metals, such as copper and nickel on polyimide (PI) surfaces. The method consists in treating the polyimide substrate with dilute alkaline solutions to effect the hydrolysis of surface imide groups -CON-, to carboxylate groups, COOM, where M is the cation of the MOH hydrolysis solution. In a subsequent step, the hydrolyzed polyimide surface is immersed in a solution containing Pd2+ ions in order to exchange the latter with the cations M present on the surface. The PI substrate is then pretreated with forming gas to reduce Pd2+ to the Pd0 catalyst form, and finally placed in the electroless bath for the catalytic metal deposition.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 89% of the total text.

Metallization of Hydrolyzed Polyimide Surfaces Catalyzed by Ion Exhanged Pd

      Disclosed is a method for the catalysis and electroless
deposition of metals, such as copper and nickel on polyimide (PI)
surfaces.  The method consists in treating the polyimide substrate
with dilute alkaline solutions to effect the hydrolysis of surface
imide groups -CON-, to carboxylate groups, COOM, where M is the
cation of the MOH hydrolysis solution.  In a subsequent step, the
hydrolyzed polyimide surface is immersed in a solution containing
Pd2+ ions in order to exchange the latter with the cations M present
on the surface.  The PI substrate is then pretreated with forming gas
to reduce Pd2+ to the Pd0 catalyst form, and finally placed in the
electroless bath for the catalytic metal deposition.

      Polyimide surfaces catalyzed with Pd in the manner described
begin to plate rapidly (within 1 minute) in an electroless copper
bath free of cyanide, as well as in hypophosphite Ni baths.  In both
cases, metal coverage was immediately achieved forming a continuous,
pore-free layer. Best adhesion values of Cu to polyimide are obtained
in hydrolysis solutions based on KOH or NaOH (or Na2Co3) rather than
weaker base, such as NH4OH.

      Selective seeding and electroless metal deposition on
multilayer structures constructed using photosensitive polyimide is
possible using the methods described.  In this case, the PI layer on
which lines and vias are to be plated is first hydr...