Browse Prior Art Database

Process for Attaching a Tape Bonded Module to a Heat Sink

IP.com Disclosure Number: IPCOM000103205D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Schwenn, KW: AUTHOR

Abstract

By providing an additional hole in a printed circuit card to which a tape mounted integrated circuit chip is attached, air pressure can be applied under the mounting tape to force the chip into contact with conductive adhesive on the heat sink. Thus, chips are pressed into parallelism with the heat sink while the conductive adhesive sets.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Process for Attaching a Tape Bonded Module to a Heat Sink

      By providing an additional hole in a printed circuit card to
which a tape mounted integrated circuit chip is attached, air
pressure can be applied under the mounting tape to force the chip
into contact with conductive adhesive on the heat sink.  Thus, chips
are pressed into parallelism with the heat sink while the conductive
adhesive sets.

      Referring to the figure, integrated circuit chip 2 is attached
to flexible tape automated bonding (TAB) material 4.  Connections
from TAB 4 are made to printed circuit card 6 which has a hole 8.
A slow setting conductive adhesive 10 is applied to the upper portion
of chip 2 and\or to the under side of heat sink 12.  Then, heat sink
12 is fastened to printed circuit board 6 by any means, e.g., rivets
14. Pressurized gas 16 is then applied through hole 8 to lift chip 2,
thereby squeezing out excess adhesive 10 and causing chip 2 to become
parallel to the surface of heat sink 12 while adhesive 10 sets.

      Disclosed anonymously.