Browse Prior Art Database

Jumper for Dual Inline Packaged (DIP) Integrated Circuits

IP.com Disclosure Number: IPCOM000103250D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Taylor, JR: AUTHOR

Abstract

The mechanism shown in Figure 1 is a unique, simple and reliable connector for providing field upgrades to existing DIP modules on populated printed circuit boards without soldering.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Jumper for Dual Inline Packaged (DIP) Integrated Circuits

      The mechanism shown in Figure 1 is a unique, simple and
reliable connector for providing field upgrades to existing DIP
modules on populated printed circuit boards without soldering.

      A preformed flex circuit board 1 is populated with capacitors 2
or other electronic components, then folded around the spring clip 3
and placed over the "DIP" package 4 providing the addition to the
circuitry needed.

      The flex circuit board is etched and plated to provide a land 5
to pin 6 contact, thus jumpering the DIP with the component
necessary.  The spring clip 3 provides the force to make electrical
contact, as well as a "gas tight" connection, and is secured by tabs
7 on each end that "bite" into the plastic to hold it in place.

      This connector provides a quick, reliable, method of upgrading
boards in the field which eliminates removal of the board and returns
to the manufacturing plant for updating.

      The features believed to be new are:
      1.  A direct pad to pin flex cable connector where the clamping
force is provided by the spring clip.
      2.  A direct pad to pin contact which enables high density
packaging.
      3.  A direct pad to pin contact requiring no heat during
installation, no soldering in the field.
      4.  A "one time" application to fix specific problems found
after release.

      Disclosed anonymously.