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Simultaneous Solder Reflow And Adhesive Curing

IP.com Disclosure Number: IPCOM000103269D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Eberly, BA: AUTHOR

Abstract

A process utilizing the rapid heat transfer of condensation heating to concurrently reflow solder and cure adhesives is disclosed. Use of this process permits a two-step process to be substituted with a one-step process. This results in a significant reduction in the cycle time to produce a part.

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Simultaneous Solder Reflow And Adhesive Curing

      A process utilizing the rapid heat transfer of condensation
heating to concurrently reflow solder and cure adhesives is
disclosed.  Use of this process permits a two-step process to be
substituted with a one-step process.  This results in a significant
reduction in the cycle time to produce a part.

      The process is a simple process consisting of the following
steps:
      1.   A printed circuit board is assembled with connectors,
solder preforms, and flux.
      2.   The component which is to be adhesively bonded to the
assembly is then mechanically attached with an adhesive preform
sandwiched between the printed circuit board and the component. NOTE:
In our application, the mechanical attachment for the adhesive
component and the soldered component was the same.  This eliminated
additional fixturing.
      3.   This entire assembly is then immersed in the condensation
heating vapor (typically FC-70*, trademark of 3M Company) for 1 to 2
minutes.
      4.   The assembly is then removed, cleaned to remove flux
residues, and allowed to cool to room temperature.

      The resultant assembly has both adhesively bonded components,
as well as soldered components.  The bond strength of the adhesively
bonded components was determined to be as good as bonds produced by
conventional oven heating.

      It was determined that two adhesive films, AF-42* and AF-126*,
produced good...