Browse Prior Art Database

ILB Lead Coining

IP.com Disclosure Number: IPCOM000103270D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Larnerd, JD: AUTHOR [+3]

Abstract

A thermocompression bonding problem in the attachment of electronic chips to a flexible film TAB (Tape Automated Bonding) tab substrate, caused by ILB (Inner Lead Bonding) lead thickness variations, is solved by coining the leads, prior to bonding, to a specified thickness controlled to +/- 0.0001" by the coining apparatus. (Figure 1).

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ILB Lead Coining

      A thermocompression bonding problem in the attachment of
electronic chips to a flexible film TAB (Tape Automated Bonding) tab
substrate, caused by ILB (Inner Lead Bonding) lead thickness
variations, is solved by coining the leads, prior to bonding, to a
specified thickness controlled to  0.0001" by the coining
apparatus.  (Figure 1).

      This process insures equally distributed thermocompression
bonding pressure and temperature on every lead, thus providing high
process yields and highly reliable bonds.

      Disclosed anonymously.