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Browse Prior Art Database

Lead Planarity Compensator for Inner Lead Bonders

IP.com Disclosure Number: IPCOM000103282D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 28K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+3]

Abstract

Disclosed is a process for compensating for the variation in lead thickness during the inner lead bonding of TAB (Tape Automated Bonding) to chips.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Lead Planarity Compensator for Inner Lead Bonders

      Disclosed is a process for compensating for the variation in
lead thickness during the inner lead bonding of TAB (Tape Automated
Bonding) to chips.

      A strip of Aluminum with a light anodized surface is placed
between the thermode surface and the leads of the TAB.  The Aluminum
strip is deformed during the bonding process, thereby accommodating
any variations in the lead thickness.  The aluminum still conducts
the heat to the joint thereby ensuring a good bond.  After each chip
is bonded the Aluminum strip is indexed forward so a new undeformed
strip is in place.  This process can be used in a reel to reel
operation or in singulated bonding.  The main advantages of this
process are better bonds for any given variation of lead thickness,
longer thermode life, and greater planarity tolerance variation for
the lead thickness or the bumps on the chip.

      Disclosed anonymously.