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Lead Format for First Level Circuit Packages

IP.com Disclosure Number: IPCOM000103331D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Tepper, H: AUTHOR

Abstract

By offsetting leads or pins on one side of a circuit module relative to leads on the other side by one half the lead pitch, straight line connections on mounting boards may be made to identical leads of each module. Wiring jogs on the mounting board are thereby eliminated and closer module spacing becomes possible.

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Lead Format for First Level Circuit Packages

      By offsetting leads or pins on one side of a circuit module
relative to leads on the other side by one half the lead pitch,
straight line connections on mounting boards may be made to identical
leads of each module.  Wiring jogs on the mounting board are thereby
eliminated and closer module spacing becomes possible.

      As shown in the figure, leads 10 on the left side of circuit
module 12 have their center lines displaced from center lines of
leads 14 on the right side of module 12 by one half of pitch P.
Leads on module 16 are identically positioned.  Common
interconnection wiring 18, e.g., address lines, control lines etc.,
on mounting board 20 are straight.  Remaining lines on board 20 to
which leads of modules 12 and 14 are connected are not shown.
Because of this new lead format for circuit modules, minimum
separation between modules 12 and 16 is not limited by jogs in common
lines 18.

      Disclosed anonymously.