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Difunctional Cyanates And Polymers Thereof

IP.com Disclosure Number: IPCOM000103347D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Gotro, JT: AUTHOR [+3]

Abstract

Disclosed is the preparation of novel difunctional cyanate monomers with increased aromatic chain length between the cyanate groups and thermosetting resins resulting from the cyclotrimerization of such monomers. By increasing the chain length between crosslinks polymers can be produced with lower glass transition temperatures compared with bisphenol A dicyanates. Full cure can be achieved at temperatures in the range of 180-250oC.

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Difunctional Cyanates And Polymers Thereof

      Disclosed is the preparation of novel difunctional cyanate
monomers with increased aromatic chain length between the cyanate
groups and thermosetting resins resulting from the cyclotrimerization
of such monomers.  By increasing the chain length between crosslinks
polymers can be produced with lower glass transition temperatures
compared with bisphenol A dicyanates.  Full cure can be achieved at
temperatures in the range of 180-250oC.

      The monomers were prepared by reacting cyanogen bromide with
bisphenol P and bisphenol M, respectively, in the presence of
triethyl amine.  Yields of the respective dicyantes were in excess of
75%.  Bisphenol P dicyanate is a crystalline solid having a melting
point at about 130oC and bisphenol M dicyanate is a viscous liquid at
room temperature.

      The ultimate glass transition temperatures are 170oC for the
bisphenol M dicyanate polymer and 230oC for the bisphenol P
dicyanate.  The degradation temperature for both polymers is over
400oC indicating excellent thermal stability.

      Resins and prepregs resulting from the monomers or prepolymers
are processable at conditions typically used to laminate FR-4 epoxy
resins.  The bisphenol P and bisphenol M dicyanates can be used to
fabricate copper clad laminate structures for making printed circuit
boards with excellent dielectric properties, thermal stability, and
good mechanical properties.

      The advantag...