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Method for Improving Photoresist Adhesion to Ptfe (teflon) Metallized Surfaces

IP.com Disclosure Number: IPCOM000103349D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Canfield, DA: AUTHOR [+5]

Abstract

Disclosed is a method for improving photoresist adhesion to Teflon (Trademark of E.I. DuPont de Nemours & Co.) metallized surfaces by adding a flash layer of electroless copper plating (approximately 0.01 - 0.05 mils thick) on top of an initial metallization layer (e.g., a Cu sputter layer). This electroless flash layer enables one to use semi-additive circuitize technology on sputtered Teflon surfaces where high density circuitization is required.

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Method for Improving Photoresist Adhesion to Ptfe (teflon) Metallized Surfaces

      Disclosed is a method for improving photoresist adhesion to
Teflon (Trademark of E.I. DuPont de Nemours & Co.) metallized
surfaces by adding a flash layer of electroless copper plating
(approximately 0.01 - 0.05 mils thick) on top of an initial
metallization layer (e.g., a Cu sputter layer).  This electroless
flash layer enables one to use semi-additive circuitize technology on
sputtered Teflon surfaces where high density circuitization is
required.

      As the printed circuit board industry moves to finer line
widths and spacings, the need for dielectric materials with a lower
dielectric constant has emerged.  One of the dielectric materials
that is being used in high circuit density applications is
polytetrafluoroethylene, also known as Teflon.  In order to
facilitate resist adhesion, most Teflon  surfaces have metal
sputtered over them first, and then resist is applied over the
sputtered metal surface. However, it has been found that poor
adhesion of resist in fine spacing areas (less than 2.5 mils) can
result even when the Teflon surface has been metallized.  The
addition of a flash layer of electroless copper over the initial
metallization layer greatly improves the photoresist adhesion,
especially in fine spacing regions.

      This flash layer of electroless copper leaves a granular,
microrough surface that is porous in nature, and conducive to
improved photoresis...