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Two-Step Process for Rapid Material Transport

IP.com Disclosure Number: IPCOM000103376D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 56K

Publishing Venue

IBM

Related People

Cuomo, JJ: AUTHOR [+2]

Abstract

The transport of material to surfaces takes many forms, atoms, ions, molecules, groups of these (clusters 10 to approximately 10000 atoms) and particles, small (submicron) and large (micron). Evaporation, sputtering and physical transport, e.g., plasma spray, techniques are among the many processes for film deposition. When the process is carried to extreme rates, where the condensation rate is very high, then concurrent or subsequent reprocessing of condensing or condensed phase is required. This is accomplished in evaporation by substrate temperature contro1, ion bombardment and in sputtering, also by the application of a bias to the substrates.

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Two-Step Process for Rapid Material Transport

      The transport of material to surfaces takes many forms, atoms,
ions, molecules, groups of these (clusters 10 to approximately 10000
atoms) and particles, small (submicron) and large (micron).
Evaporation, sputtering and physical transport, e.g., plasma spray,
techniques are among the many processes for film deposition.  When
the process is carried to extreme rates, where the condensation rate
is very high, then concurrent or subsequent reprocessing of
condensing or condensed phase is required.  This is accomplished in
evaporation by substrate temperature contro1, ion bombardment and in
sputtering, also by the application of a bias to the substrates.

      Particle spray deposition processes are capable of depositing
material at extremely high rates.  With the high deposition rate,
i.e., mils per second and large particle size, i.e., submicron to
micron, there is a tendency for these deposits to be porous with less
than bulk density.

      A process will now be described which deals with complementary
processes that take advantage of the best of each process and
combines them into a useful process that produces new desirable
results.

      The process is a combination of a spray type process (plasma
arc or flame) for the high rate materials transport with a rapid
thermal anneal process such as laser, flash lamps, stripheater
halogen lamp for the post treatment for densification.  Both
processes are ra...