Browse Prior Art Database

Spring-Loaded Heat Sinks for VLSI Packages

IP.com Disclosure Number: IPCOM000103377D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Mok, LS: AUTHOR

Abstract

Disclosed is a spring-loaded, snap-on heat sink for cooling VLSI package on a printed-wiring board. An exploded view of the heat sink is shown in the attached figure. The heat sink consists of a Cu alloy fin-like spring 11, a metal plate 12 with snap-on holes 13, a metal plate 14 with guide holes 15, and a support 16 with four snap-on heads 17. The Cu alloy fin-like spring 11 is bonded or welded on the bottom metal plate 14. The support 16 could be mounted directly on a printed wiring board 19 on which a VLSI package 20 is soldered or optionally on a frame 18 which is in turn mounted on the printed-wiring board 19.

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Spring-Loaded Heat Sinks for VLSI Packages

      Disclosed is a spring-loaded, snap-on heat sink for cooling
VLSI package on a printed-wiring board.  An exploded view of the heat
sink is shown in the attached figure.  The heat sink consists of a Cu
alloy fin-like spring 11, a metal plate 12 with snap-on holes 13, a
metal plate 14 with guide holes 15, and a support 16 with four
snap-on heads 17.  The Cu alloy fin-like spring 11 is bonded or
welded on the bottom metal plate 14.  The support 16 could be mounted
directly on a printed wiring board 19 on which a VLSI package 20 is
soldered or optionally on a frame 18 which is in turn mounted on the
printed-wiring board 19.  After the VLSI package 20 and the support
16 are in place on the printed-wiring board 19, one can then slide
the bottom plate 14 with the Cu alloy fin-like spring 11 into the
support 16 and snap the top plate 12 on.  The fin-like spring 11 will
force the bottom plate 14 in good contact with the top surface of the
package 20 and complete the thermal path for cooling the package 20.
A thermal interface material such as thermal grease can be added
between the bottom plate 14 and the package 20 to improve the
interface thermal conductance.

      Disclosed anonymously.