Browse Prior Art Database

Surface Mount Spring Clip Attach for TAB Heat Sink

IP.com Disclosure Number: IPCOM000103390D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 38K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR

Abstract

This invention provides a means of attaching a heat sink to a circuit board using a surface mounted spring clip. Although this technique focuses on a heat sink for a Tape Automated Bonding (TAB) component, it can be extended to other devices which need a heat sink supported by the circuit board.

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Surface Mount Spring Clip Attach for TAB Heat Sink

      This invention provides a means of attaching a heat sink to a
circuit board using a surface mounted spring clip. Although this
technique focuses on a heat sink for a Tape Automated Bonding (TAB)
component, it can be extended to other devices which need a heat sink
supported by the circuit board.

      As shown in Figure 1, at least two spring clips would be
attached to the board by wave solder operations or with an adhesive
and would be in place for heat sink attach. Figure 1 shows how the
clips spring open as the heat sink is forced against the attach site.
After the spring clips open enough to accept the heat sink and the
force is removed, the clips retain the edges of the heat sink, as
shown in Figure 2.

      The problem solved by the spring clip attach is that the spring
action of the clips allow for movement in the z-direction so that
thermal bonding of the heat sink to the TAB device can be achieved.
In addition, the spring clip attach provides an easy method of
removing the heat sink from the circuit card as when the TAB
component needs to be accessed for rework.

      Disclosed anonymously.