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Method for an LGA socket contact pattern that eliminates friction

IP.com Disclosure Number: IPCOM000103392D
Publication Date: 2005-Mar-17
Document File: 2 page(s) / 9K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a land-grid array (LGA) socket contact pattern that eliminates friction. Benefits include improved functionality, improved performance, and improved reliability

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Method for an LGA socket contact pattern that eliminates friction

Disclosed is a method for a land-grid array (LGA) socket contact pattern that eliminates friction. Benefits include improved functionality, improved performance, and improved reliability.

Background

      Intermittent open circuits between an LGA package and a socket can occur due to insufficient load. Friction between the package and socket contacts and between the package and socket body result in a reduction of the total load applied to the socket contacts and an uneven load distribution.

              The conventional solution is to move the load point on the integrated heatsink (IHS) shoulder to distribute the load uniformly. All contacts point in one direction, which reduces the net frictional forces between the package and contacts and between the package and socket body (see Figure 1).

Description

      The disclosed method is an LGA socket contact orientation pattern that eliminates net frictional forces on a package, which may cause intermittent open circuits due to insufficient load. The method includes LGA socket contacts oriented differently in each quadrant of the socket body.

      For example, the contact tips can be implemented using the following configuration (see Figure 2):

•             Contact tips in the first quadrant point to the 45 degree line.

•             Contact tips in the second quadrant point to the 135 degree line.

•             Contact tips in the third quadrant poin...