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Encapsulated Recessed Heat Sink

IP.com Disclosure Number: IPCOM000103406D
Publication Date: 2005-Mar-17
Document File: 2 page(s) / 158K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a second-level heat sink with a recessed base to confine second-level thermal interface material (TIM). Benefits include improved performance and a reduced risk of leakage that can lead to component damage.

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Encapsulated Recessed Heat Sink

Disclosed is a method that uses a second-level heat sink with a recessed base to confine second-level thermal interface material (TIM). Benefits include improved performance and a reduced risk of leakage that can lead to component damage.

Background

There are two main approaches to applying TIMs:

1.      Using a grease syringe to deposit the TIM on the integrated heat spreader (IHS) and simply attach the second-level heat sink to the TIM. During bake stresses, there is a propensity for this material to flow out onto the motherboard and socket area.

2.      Using a pad-like TIM with aluminum fillers. This approach is more user-friendly, and enables the direct attachment of the pad-like TIM to the base of the heat sink and the simple installation of the heat sink to the IHS.

Figure 1 shows the POR standard package stack-up with an average orthogonal aluminum extruded heat sink. It also shows the current heat sink base design. In current solutions, there is no feature in the heat sink to confine the TIM. Unfortunately, current approaches do not address the problem of pumping the TIM out, and reducing the risk of shorting other components due to electrical conductive nature of the TIM.

General Description

The disclosed method uses a heat sink with a recessed base to confine TIM. This confinement is achieved by sealing the edges of the heat sink with an epoxy-based sealant. Figure 2 shows the sealant at the heat sink edges. The sealant is an epoxy-based poly...